How can thermally conductive silicone sheet achieve efficient heat dissipation and multiple performance balance at a thermal conductivity of 1.5W/mK?
Publish Time: 2025-04-29
With the trend of modern electronic devices becoming increasingly high-performance and thin, heat dissipation has become one of the key factors restricting product stability and service life. As a thermal interface material that combines thermal conductivity, insulation and flexibility, thermally conductive silicone sheet is widely used in notebook computers, automotive control modules, power supply equipment and other fields with extremely high space and performance requirements. In particular, silicone sheets with a thermal conductivity of 1.5W/mK are becoming an ideal choice for engineers to optimize heat dissipation design due to their excellent comprehensive performance.First of all, the core advantage of this thermally conductive silicone sheet lies in its excellent thermal conductivity. Although the thermal conductivity of 1.5W/mK does not belong to the top high thermal conductivity materials (such as above 3W), it is sufficient to meet the needs in most conventional application scenarios. It can effectively fill the gap between the graphics card and the radiator, and between the heat dissipation module and the shell, improve the heat conduction efficiency, reduce thermal resistance, and thus prevent system frequency reduction or hardware damage caused by local high temperature. Especially in compact devices, such as ultra-thin notebooks or high-performance SSD hard drives, this material can play a key role in thermal management in limited space.Secondly, the low oil permeability property allows it to maintain structural stability during long-term use, and will not contaminate surrounding components due to silicone oil precipitation. This feature is particularly important for precision electronic equipment, avoiding the risk of circuit short circuits or poor connections. At the same time, the material has double-sided self-adhesiveness, which is easy to install without the need for additional glue or other fixings, greatly simplifying the assembly process and improving production efficiency.In addition, this thermally conductive silicone sheet also has good electrical insulation and temperature resistance. It can work stably in the temperature range of -40°C to 200°C, suitable for industrial and automotive applications in harsh environments. For example, in automotive engine control units (ECUs), materials must not only withstand high temperature shocks, but also resist vibration and humidity, and this silicone sheet can meet the requirements of these complex working conditions. Its high softness and high compressibility ensure that it can adapt to irregular surfaces and achieve full fit under less pressure, effectively improving heat dissipation efficiency.It is worth mentioning that its "low compression force + high compression rate" design makes it particularly suitable for use between pressure-sensitive components. For example, in high-speed large storage drives or power conversion modules, excessive pressure may cause chip displacement or solder joint breakage, while this silicone sheet can still maintain good thermal contact under slight pressure, taking into account reliability and safety.From an application perspective, the thermally conductive silicone sheet is not limited to traditional consumer electronics, but also shows broad prospects in new energy vehicles, intelligent driving control systems, industrial automation equipment and other fields. For example, in the on-board battery management system (BMS), it can be used for heat conduction between the battery cell and the cooling plate; in the server room, it can also be used between the CPU and the heat sink to help maintain the stability of the system's long-term operation.In summary, based on the thermal conductivity of 1.5W/mK, the thermally conductive silicone sheet combines a variety of excellent properties such as low oil penetration, double-sided self-adhesion, high insulation, high and low temperature resistance, softness and compliance, etc., providing a reliable solution for efficient heat dissipation of modern electronic products. Whether it is a technology company pursuing extreme performance or an industrial user focusing on stability, they can get an ideal application experience from it. In the future, as electronic products continue to develop towards miniaturization and high performance, this type of thermal management material that is both functional and practical will play an increasingly important role.
